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高密度挠性印制电路材料

来源:网络整合 日期:2018-8-25

 摘 要 | 挠性电路的特性驱使挠性电路市场持续快速的增长,同时市场的需求驱使挠性电路技术的日趋发展,高密度互连技术在挠性印制电路板中的应用正是迎合市场需求而快速发展起来的。面对HDI的挑战,领先的挠性电路制造商转向新的材料,提高标准材料的样式,以及新的制作工艺技术。本文介绍了高密度挠性电路对材料的要求以及近几年发展起来的高密度挠性电路材料。

  关键词 | 高密度互连,挠性板材料,无胶基材

  XIAOFEIZHECHIXUDIZHUIQIUGENGQING、GENGXIAO、GONGNENGGENGDUODEDIANZISHEBEI,ZHEIYANGJINAOXINGDIANLUXINDEYINGYONGTIGONGLEGENGDUODEJIHUI,NAOXINGDIANLUGENGYIYUQING、XIAODESHEBEISHEJISHINAOXINGDIANLUBIANDEYUELAIYUETONGYONG,ZAIXUDUOSHIYONGGANGXINGBANDELINGYUKAISHIZAIZHUJIANDIBEINAOXINGBANSUOTIDAI,LIRUCOF(chip-on-flex)DEYINGYONG,NAOXINGDIANLUJUBUDEFUZAXINGYIJINGDENGTONGYUGANGXINGDUOCENGBAN,NAOXINGDIANLUDEZUOYONGYECONGJINJINHULIANZHUANYIDAOGONGNENGXINGDEDIANLUBAN。NAOXINGDIANLUDETEXINGQUSHINAOXINGDIANLUSHICHANGCHIXUKUAISUDEZENGZHANG,TONGSHISHICHANGDEXUQIUQUSHINAOXINGDIANLUJISHUDERIQUFAZHAN,GAOMIDUHULIANJISHUZAINAOXINGYINZHIDIANLUBANZHONGDEYINGYONGZHENGSHIYINGHESHICHANGXUQIUERKUAISUFAZHANQILAIDE。

  JINJINIANDESHICHANGQUSHIXIANSHI,GAOMIDUHULIANJISHUJIHDI DEZENGZHANGSUDUSHIPUTONGXIANLUDEERBEIDUO。HDIDIANLUTONGCHANGZHIXIANLUDEJIEJUXIAOYU8mils(200μm),KONGJINGXIAOYU10mils(250μm)。CHAOHDI(Ultra-HDI)——HDIDEYIGEFENZHI,SHIZHIJIEJUXIAOYU4mils(100μm),KONGJINGXIAOYU3mils(75μm)。

  据估计,驱使HDI挠性板增长的最重大的应用是在手机和其它的手持通讯和计算机设备(如PDA等),其它的高增长应用有用于芯片封装的带式挠性板、硬盘驱动器的悬浮式挠性电路和互连、平面显示器的挠性板、以及喷墨打印机墨盒的挠性电路等。
在当今快速变化的市场竞争中,很显然挠性电路制造商必须要调整设计能力、选择材料以及制造工艺,以确保处于有利的竞争地位。

  一、高密度挠性电路对材料的要求

  NAOXINGDIANLUZHIZAOSHANGXIWANGZAIRIYIXINGWANGDEHDINAOXINGDIANLUSHICHANGSHANGZHANJUYOULIDIWEI,JIUBIXUKAIFAYOUXIAODEJIESHENGCHENGBENDEHDIZHIZUONENGLI。MIANDUIHDIDETIAOZHAN,LINGXIANDENAOXINGDIANLUZHIZAOSHANGZHUANXIANGXINDECAILIAO,TIGAOBIAOZHUNCAILIAODEYANGSHI,YIJIXINDEZHIZUOGONGYIJISHU。TONGCHANG,SHIYONGYIZHONGXINDECAILIAO,ZHIZAOSHANGJIUBIXUGAIBIANQIGONGYIHUOTOURUYIXIEXINDEGONGYIJISHU。

  JINSHIJINIANLAI,WEILEMANZUHDISHEJIJIYINGYONGDEXUQIUKAIFALEXUDUOGAOMIDUNAOXINGDIANLUYONGCAILIAO,TAMENBAOKUOGAOXINGNENGDEJIDIMO、WUJIAOJICAI、YETIPISHUZHI,GANGUANGFUGAICENGDENG,JIANBIAO1。

表1 高密度挠性电路用材料

  HDIYINGYONGYAOQIUGENGJIAJINGXIDEXIANLUHEGENGXIAODEDAOTONGKONG,YINCIZAINAOXINGDIANLUZHIZUOSHIXUYAOGENGBODEDAOTICENGHEJICAI,RANERBOJICAIDEWULIXINGNENGWANGWANGNANYIMANZUJISHUYAOQIU,BIAO2LIECHULEYIXIEXINGNENGBUZUZHICHU。

  GAOMIDUNAOXINGDIANLUDUICAILIAODEYAOQIUZHUYAOTIXIANZAIYIXIAFANGMIAN:

  (1) 挠性材料的尺寸稳定性

  GUOQU,SHIYONGNAOXINGBANHEGANGXINGZAIBANKEYIGANZHIDAODEQUEDIANZHIYISHINAOXINGCAILIAOZAIZHIZUOGUOCHENGZHONGYOUJIAODADECHICUNBIANHUA,NAOXINGDIANLUZUICHANGYONGDEJICAI——PIMOZAIDIANLUZHIZUOZHONGSUIZHEZAIMOJIJICAIDECENGYAZHONGCHANSHENGDEYINGLIDEXIAOCHUJIUHUISHOUSUO,ZHEIZHONGSHOUSUOHUIYINGXIANGDAODIANLUCENGHEFUGAIMODEDUIWEI,YIJIANZHUANGZUJIANDEDUIWEI。DIANLUZHIZAOSHANG,YOUQISHINAOXINGBANZHIZAOSHANGDOUFEICHANGGUANXINCAILIAODECHICUNWENDINGXING,ZAIHDIDIANLUZHONGGENGSHIRUCI。BODECAILIAOJIANGHUIYINGXIANGDAOFPCDEXINGNENGHESHENGCHANLIANGLV,ZAIGAOMIDUNAOXINGDIANLUZHIZUOZHONGCAILIAODECHICUNWENDINGXINGSHIYINGXIANGLIANGPINLVDEZHUYAOYINSU。YAODEDAOGAOKEKAOXINGDEGAOMIDUDIANLUCHANPINBIXUYAOJIEJUECAILIAO、JIEGOUHEZHIZUOGUOCHENGJIANDEMAODUN。

表2 高性能材料的不足之处

  (2) 挠性材料粘结剂的抗电迁移性

  ZAINAOXINGDIANLUZHONGDIANQIANYISHIYIZHONGDAOZHIDIANLUZAODAOPOHUAIDEXIANXIANG,YOUYIXIELEIXINGDENAOXINGDIANLUZHANJIEJIDANGCHUZAICHAOSHI、WENDUSHENGGAOYIJICHUXIANPIANDIANYASHIDIANLUXIANZHONGDETONGLIZINENGGOUTONGGUOZHANJIEJIFASHENGYIDONG,CONGERZAIZHENGJIHEFUJIJIANLIANCHENGYITIAOXIAN。DANGLIZIZAITONGDAOXIANZHIJIANKAISHIPAILIESHI,ZHEIZHONGSIKAISHISHICHENGSHUZHIZHUANGHUOSHANDIANZHUANG,ZAIJIDUANQINGKUANGXIA,ZHEIZHONGSIZAILIANGTIAOXIANZHIJIANLIANJIEQILAIDADAOYIDINGDEHOUDUJIUHUIYINQIDUANLU。

  SUIZHEDIANYAYIJIXIANLUMIDUDEZENGJIA,YOUYUDIANQIANYIYINQIDEDIANLUKEKAOXINGWENTIYEMINGXIANZENGJIA,YINCI,HDIDEYINGYONGDAIBIAOZHEQIANZAIDEWEIXIANYEZENGJIA,XIANLUSHEJIZHEBIXUYAOYISHIDAOZHEIXIEQIANZAIDEWENTIBINGQIECAIQUCUOSHILAIYUFANG。MUQIANYOUYIXIENAOXINGCAILIAOJIUSHISHEJICHENGKANGDIANQIANYI,JISHISHIZAIELIEDEHUANJINGTIAOJIANXIA。ZHEIYIDIANDUIYUHDINAOXINGDIANLUSHEJIZHEHEZHIZAOSHANGLAISHUOSHIZHIGUANZHONGYAODE。

  (3) 薄的和低型面铜箔

  YAODADAOHDIDENAOXINGDIANLUDEZHUYAOFANGFAZHIYISHITONGGUOSHIYONGBODE、JINGXIKELIDEYIJIDIXINGMIANTONGBO,CHANGGUINAOXINGDIANLUYONGDEBIAOZHUNTONGBOTONGCHANGDEHOUDUSHI1oz(35μm),DUIYUPUTONGMIDUDETUXING,1oz TONGBOKEYITIGONGHESHIDEXINGNENG,KESHIDUIYUHDIDEYINGYONG,DUOSHUDEZHIZAOSHANGSHICAIYONG1/2oz(18μm)、1/3oz(12μm),SHENZHISHI1/4oz(9μm)DETONGBO。

  (4) 覆盖膜粘结剂流动度的控制

  ZAIHDIDIANLUZHONGSHIYONGFUGAIMOZUIZHUYAODESHIZHIZUOXIAODECHUANGKOU(YEKENENGBICIKAODEHENJIN),YIJIQUEBAOCHUANGKOUZAICENGYASHIBUBEIZHANJIEJITIANCHONG,YIFANGBAOLUDETONGBEIFUGAI,YINCI,XUANZEHDIYONGDEFUGAIMOCAILIAOBIXUYAOYANGEKONGZHIQILIUDONGXINGNENG。TAIXIAODELIUDONGXINGHUIZAIJINGXIXIANLUJIANCHANSHENGKONGDONG,JIANGDIDIANJUEYUANXINGNENG;TAIDADELIUDONGXINGHUIFUGAICHUANGKOU。BUSHISUOYOUDENAOXINGZHANJIEJIYOUZHEIZHONGXINGNENG,YUGANGXINGBANZHIZUOZHONGDE“DILIUDONGDU”DEBANGUHUAPIANXIANGLEISI。ZHIZAOSHANGBIXUXUANZEHESHIDEFUGAIMOYIJIGENJUZHANJIEJIDELIUDONGXINGXUANZEHESHIDECENGYAGONGYI。

  二、高密度挠性电路材料

  NAOXINGDIANLUDEJIBENCAILIAOBAOKUOYOUJIDICAILIAO、DAOTIHEFUGAICENG,JIDICAILIAOHEDAOTITONGCHANGSHIYAHECHENGFUTONGBOCENGYABAN。XIAMIANJIANGJIESHAOJIZHONGZHONGYAODEYONGYUHDINAOXINGDIANLUDECAILIAO。

  2.1 导体材料

  YAODADAOHDIDENAOXINGDIANLUDEZHUYAOFANGFAZHIYISHITONGGUOSHIYONGBODE、JINGXIKELIDEYIJIDIXINGMIANTONGBO,CHANGGUINAOXINGDIANLUYONGDEBIAOZHUNTONGBOYIZHISHIYAYANTONGBO(RA),TONGCHANGDEHOUDUSHI1oz(35μm),DUIYUPUTONGMIDUDETUXING,1oz RATONGBOKEYITIGONGHESHIDEXINGNENG,KESHIDUIYUHDIDEYINGYONG,DUOSHUDEZHIZAOSHANGSHICAIYONG1/2oz(18μm)SHENZHISHI1/3oz(12μm)DERATONGBO。YAYANTONGBODECHENGBENSHISUIZHEQIHOUDUBIANBOERSHENGGAO,HOUDUBO、SHIKESUDUKUAIDETONGBOQICHENGBENJIUGAO。HAOWUYIWEN,1/2ozDEJINSHUBOCENGYABANJIANGCHENGWEIHDIYINGYONGDEBIAOZHUNCAILIAO,1/3ozTONGBODEYINGYONGJIANGHUIZENGJIA。JIANGLAI,RATONGDEHOUDUKEYIDIYU10μm ,KEYIZHIZUOCHENGZAITITONGBO,DANSHI,GONGYIHECAILIAOCHENGBENJIANGHUIDAFUDUTIGAO。